24-3551-18 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 24POS, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Beryllium Nickel, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Nickel Boron, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Nickel, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Nickel Boron, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyetheretherketone (PEEK), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 250°C, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing.