24-526-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.54 EUR |
| 17+ | 19.27 EUR |
| 34+ | 18.34 EUR |
| 51+ | 17.83 EUR |
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Technische Details 24-526-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 24-526-10 nach Preis ab 24.87 EUR bis 47.03 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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24-526-10 | ARIES |
Description: ARIES - 24-526-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 24Kontakt(e) Reihenabstand: 15.24mm Steckverbinder: DIP Produktpalette: 526 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 29 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 24-526-10 |
|
Hersteller: ARIES
Description: ARIES - 24-526-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 24Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: 526
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 24-526-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 24Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: 526
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 29 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 47.03 EUR |
| 10+ | 32.46 EUR |
| 25+ | 24.87 EUR |