24-6518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.14 EUR |
| 10+ | 3.8 EUR |
| 20+ | 3.42 EUR |
| 100+ | 3.28 EUR |
| 260+ | 2.92 EUR |
| 500+ | 2.84 EUR |
| 1000+ | 2.75 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
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Produktbewertung abgeben
Technische Details 24-6518-10 Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 24-6518-10 nach Preis ab 3.24 EUR bis 4.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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24-6518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 134 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6518-10 | ARIES |
Description: ARIES - 24-6518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 24Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 24-6518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.49 EUR |
| 20+ | 3.63 EUR |
| 40+ | 3.45 EUR |
| 60+ | 3.36 EUR |
| 100+ | 3.24 EUR |
| 24-6518-10 |
|
Hersteller: ARIES
Description: ARIES - 24-6518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 24Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
Description: ARIES - 24-6518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 24Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)