24-6518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.14 EUR |
| 10+ | 3.8 EUR |
| 20+ | 3.42 EUR |
| 100+ | 3.28 EUR |
| 260+ | 2.92 EUR |
| 500+ | 2.84 EUR |
| 1000+ | 2.75 EUR |
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Technische Details 24-6518-10 Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole.
Weitere Produktangebote 24-6518-10 nach Preis ab 3.24 EUR bis 4.49 EUR
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24-6518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole |
auf Bestellung 134 Stücke: Lieferzeit 10-14 Tag (e) |
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| 24-6518-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.49 EUR |
| 20+ | 3.63 EUR |
| 40+ | 3.45 EUR |
| 60+ | 3.36 EUR |
| 100+ | 3.24 EUR |