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Technische Details 24-6554-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 24-6554-11 nach Preis ab 58.79 EUR bis 81.35 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-6554-11 | ARIES |
 Description: ARIES - 24-6554-11 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 6554, 15.24 mm, BerylliumkupfertariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 24Kontakt(e) Steckverbinder: DIP euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 6554 SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) |
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24-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS GLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 24-6554-11 |
|
Hersteller: ARIES
Description: ARIES - 24-6554-11 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 6554, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 24Kontakt(e)
Steckverbinder: DIP
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 6554
SVHC: No SVHC (15-Jan-2018)
Description: ARIES - 24-6554-11 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 6554, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 24Kontakt(e)
Steckverbinder: DIP
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 6554
SVHC: No SVHC (15-Jan-2018)
auf Bestellung 8 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 79.85 EUR |
| 5+ | 64.02 EUR |
| 24-6554-11 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 81.35 EUR |
| 10+ | 69.14 EUR |
| 30+ | 63.99 EUR |
| 50+ | 61.73 EUR |
| 100+ | 58.79 EUR |