| Anzahl | Preis |
|---|---|
| 4+ | 70.02 EUR |
| 10+ | 57.38 EUR |
| 30+ | 51.14 EUR |
| 50+ | 47.43 EUR |
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Technische Details 240-1288-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 240-1288-00-0602J nach Preis ab 56.21 EUR bis 74.91 EUR
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240-1288-00-0602J | Hersteller : 3M Electronic Solutions Division |
 IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty. |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 40POS GLD Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | Hersteller : 3M |
Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |