| Anzahl | Privatkunde |
|---|---|
| 4+ | 84.29 EUR |
| 10+ | 70.61 EUR |
| 30+ | 63.93 EUR |
| 50+ | 60.3 EUR |
Produktrezensionen
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Technische Details 240-1288-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 240-1288-00-0602J nach Preis ab 66.89 EUR bis 93.58 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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240-1288-00-0602J | 3M Electronic Solutions Division |
 IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty. |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 40POS GLD Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 240-1288-00-0602J |
|
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty.
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 87.44 EUR |
| 10+ | 75.86 EUR |
| 20+ | 70.03 EUR |
| 50+ | 69.53 EUR |
| 100+ | 67.04 EUR |
| 200+ | 66.89 EUR |
| 240-1288-00-0602J |
|
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 93.58 EUR |
| 10+ | 79.54 EUR |
| 30+ | 73.6 EUR |
| 50+ | 71 EUR |
| 100+ | 67.62 EUR |