248-5205-00 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets Textool QFN .5MM,48P EVEN RW,W/O THRML PN
| Anzahl | Preis |
|---|---|
| 1+ | 167.96 EUR |
| 10+ | 142.75 EUR |
| 25+ | 135.19 EUR |
| 50+ | 129.82 EUR |
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Technische Details 248-5205-00 3M Electronic Solutions Division
Description: CONN SOCKET QFN 48POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 48 (4 x 12), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 248-5205-00 nach Preis ab 142.68 EUR bis 179.04 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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248-5205-00 | 3M |
Description: CONN SOCKET QFN 48POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: QFN Number of Positions or Pins (Grid): 48 (4 x 12) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 248-5205-00 |
|
Hersteller: 3M
Description: CONN SOCKET QFN 48POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 48 (4 x 12)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET QFN 48POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 48 (4 x 12)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 179.04 EUR |
| 10+ | 152.2 EUR |
| 25+ | 142.68 EUR |