248-5205-00 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets Textool QFN .5MM,48P EVEN RW,W/O THRML PN
| Anzahl | Privatkunde |
|---|---|
| 1+ | 201.9 EUR |
| 10+ | 171.6 EUR |
| 25+ | 160.88 EUR |
| 50+ | 154.49 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 248-5205-00 3M Electronic Solutions Division
Description: CONN SOCKET QFN 48POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 48 (4 x 12), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 248-5205-00 nach Preis ab 169.79 EUR bis 379.32 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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248-5205-00 | 3M |
Description: CONN SOCKET QFN 48POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: QFN Number of Positions or Pins (Grid): 48 (4 x 12) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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248-5205-00 | 3M |
Description: 3M - 248-5205-00 - IC- & Baustein-Sockel, 48 Kontakt(e), QFN-Prüfbuchse, 0.5 mm, Text Tool, Beryllium-Kupfer Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: QFN-Prüfbuchse Rastermaß: 0.5 Anzahl der Kontakte: 48 Kontaktmaterial: Beryllium-Kupfer Reihenabstand: - Produktpalette: Text Tool SVHC: No SVHC (20-Jun-2016) |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 248-5205-00 |
|
Hersteller: 3M
Description: CONN SOCKET QFN 48POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 48 (4 x 12)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET QFN 48POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 48 (4 x 12)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 213.06 EUR |
| 10+ | 181.12 EUR |
| 25+ | 169.79 EUR |
| 248-5205-00 |
|
Hersteller: 3M
Description: 3M - 248-5205-00 - IC- & Baustein-Sockel, 48 Kontakt(e), QFN-Prüfbuchse, 0.5 mm, Text Tool, Beryllium-Kupfer
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: QFN-Prüfbuchse
Rastermaß: 0.5
Anzahl der Kontakte: 48
Kontaktmaterial: Beryllium-Kupfer
Reihenabstand: -
Produktpalette: Text Tool
SVHC: No SVHC (20-Jun-2016)
Description: 3M - 248-5205-00 - IC- & Baustein-Sockel, 48 Kontakt(e), QFN-Prüfbuchse, 0.5 mm, Text Tool, Beryllium-Kupfer
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: QFN-Prüfbuchse
Rastermaß: 0.5
Anzahl der Kontakte: 48
Kontaktmaterial: Beryllium-Kupfer
Reihenabstand: -
Produktpalette: Text Tool
SVHC: No SVHC (20-Jun-2016)
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 379.32 EUR |
| 5+ | 308.19 EUR |
| 10+ | 235.7 EUR |