248-5205-01 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets Textool QFN .5MM,48P EVEN ROW,W/THRML PIN
| Anzahl | Privatkunde |
|---|---|
| 1+ | 245.1 EUR |
| 10+ | 208.35 EUR |
| 50+ | 191.01 EUR |
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Technische Details 248-5205-01 3M Electronic Solutions Division
Description: CONN SOCKET QFN 48POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.020" (0.50mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 48 (4 x 12), Type: QFN, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 248-5205-01 nach Preis ab 249.21 EUR bis 249.21 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
 |
248-5205-01 | 3M |
Description: CONN SOCKET QFN 48POS GOLD Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish - Post: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Pitch - Mating: 0.020" (0.50mm) Housing Material: Polyethersulfone (PES) Termination: Solder Number of Positions or Pins (Grid): 48 (4 x 12) Type: QFN Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 248-5205-01 |
|
Hersteller: 3M
Description: CONN SOCKET QFN 48POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.020" (0.50mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 48 (4 x 12)
Type: QFN
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET QFN 48POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.020" (0.50mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 48 (4 x 12)
Type: QFN
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 249.21 EUR |