Produktrezensionen
Produktbewertung abgeben
Technische Details 2485264-1 TE Connectivity
Description: DIP IC SOCKET 8P,GOLD FLASH, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2485264-1 nach Preis ab 0.79 EUR bis 2.57 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
2485264-1 | TE Connectivity |
 Connector DIP IC Socket 8Pos |
auf Bestellung 4682 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||
 |
2485264-1 | TE Connectivity |
IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH |
auf Bestellung 1915 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
2485264-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 8P,GOLD FLASH Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 1552 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
2485264-1 | TE CONNECTIVITY |
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366990 euEccn: NLR rohsCompliant: Y-EX Kontaktüberzug: Hauchvergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Anzahl der Kontakte: 8Kontakt(e) SVHC: Lead (04-Feb-2026) Reihenabstand: 7.62mm Steckverbinder: DIP-Sockel Produktpalette: - productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 4623 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 2485264-1 |
|
Hersteller: TE Connectivity
Connector DIP IC Socket 8Pos
Connector DIP IC Socket 8Pos
auf Bestellung 4682 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 218+ | 0.79 EUR |
| 2485264-1 |
|
Hersteller: TE Connectivity
IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH
IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH
auf Bestellung 1915 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.87 EUR |
| 10+ | 1.59 EUR |
| 25+ | 1.49 EUR |
| 112+ | 1.4 EUR |
| 280+ | 1.31 EUR |
| 504+ | 1.21 EUR |
| 1008+ | 1.14 EUR |
| 2485264-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
Description: DIP IC SOCKET 8P,GOLD FLASH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 1552 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.12 EUR |
| 12+ | 1.78 EUR |
| 25+ | 1.67 EUR |
| 56+ | 1.58 EUR |
| 112+ | 1.5 EUR |
| 280+ | 1.4 EUR |
| 504+ | 1.36 EUR |
| 1008+ | 1.29 EUR |
| 2485264-1 |
|
Hersteller: TE CONNECTIVITY
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Hauchvergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Hauchvergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 4623 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 98+ | 2.57 EUR |
| 120+ | 1.94 EUR |
| 139+ | 1.55 EUR |
| 500+ | 1.34 EUR |