2485264-1 TE Connectivity
| Anzahl | Preis |
|---|---|
| 2+ | 1.45 EUR |
| 10+ | 1.27 EUR |
| 25+ | 1.2 EUR |
| 112+ | 1.16 EUR |
| 280+ | 1.07 EUR |
| 504+ | 0.99 EUR |
| 1008+ | 0.91 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2485264-1 TE Connectivity
Description: DIP IC SOCKET 8P,GOLD FLASH, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2485264-1 nach Preis ab 0.93 EUR bis 1.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
2485264-1 | TE Connectivity AMP Connectors |
 Description: DIP IC SOCKET 8P,GOLD FLASHPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 2034 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
2485264-1 | TE CONNECTIVITY |
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366990 productTraceability: No Kontaktüberzug: Hauchvergoldete Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: Lead (04-Feb-2026) |
auf Bestellung 4777 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 2485264-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
Description: DIP IC SOCKET 8P,GOLD FLASH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 2034 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 12+ | 1.51 EUR |
| 14+ | 1.28 EUR |
| 25+ | 1.2 EUR |
| 56+ | 1.13 EUR |
| 112+ | 1.08 EUR |
| 280+ | 1.01 EUR |
| 504+ | 0.97 EUR |
| 1008+ | 0.93 EUR |
| 2485264-1 |
|
Hersteller: TE CONNECTIVITY
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 8Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (04-Feb-2026)
Description: TE CONNECTIVITY - 2485264-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 8Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (04-Feb-2026)
auf Bestellung 4777 Stücke:
Lieferzeit 14-21 Tag (e)