2485267-2

2485267-2 TE Connectivity AMP Connectors


DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-2 Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 5400 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
900+0.62 EUR
1800+0.58 EUR
2700+0.56 EUR
4500+0.54 EUR
Mindestbestellmenge: 900
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 2485267-2 TE Connectivity AMP Connectors

Description: DIP IC SOCKET 8P,GOLD FLASH-SMD, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 2485267-2

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
2485267-2 2485267-2 Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-2 Description: DIP IC SOCKET 8P,GOLD FLASH-SMD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 5400 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
2485267-2 Hersteller : TE Connectivity DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-2 2485267-2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2485267-2 Hersteller : TE Connectivity DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-2 2485267-2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2485267-2 2485267-2 Hersteller : TE Connectivity ENG_CD_2485267_1-3475774.pdf IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH-SMD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH