2485267-2 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD
Packaging: Tape & Reel (TR)
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
| Anzahl | Privatkunde |
|---|---|
| 900+ | 0.92 EUR |
| 1800+ | 0.87 EUR |
| 2700+ | 0.84 EUR |
| 4500+ | 0.82 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
900 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 2485267-2 TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD, Packaging: Tape & Reel (TR), Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2485267-2 nach Preis ab 1.06 EUR bis 1.55 EUR
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2485267-2 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD Packaging: Cut Tape (CT) Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 5268 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 2485267-2 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD
Packaging: Cut Tape (CT)
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
Description: DIP IC SOCKET 8P,GOLD FLASH-SMD
Packaging: Cut Tape (CT)
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 5268 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 14+ | 1.55 EUR |
| 16+ | 1.33 EUR |
| 25+ | 1.25 EUR |
| 50+ | 1.19 EUR |
| 100+ | 1.13 EUR |
| 250+ | 1.06 EUR |