25-0503-30 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.58 EUR |
| 10+ | 23.43 EUR |
| 50+ | 20.47 EUR |
| 100+ | 18.93 EUR |
| 250+ | 18.2 EUR |
| 500+ | 17.61 EUR |
| 1000+ | 17.5 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
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Produktbewertung abgeben
Technische Details 25-0503-30 Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 25 (1 x 25), Termination: Wire Wrap, Housing Material: Polyamide (PA), Nylon, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 25-0503-30 nach Preis ab 18.58 EUR bis 46.16 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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25-0503-30 | Aries Electronics |
 Description: CONN SOCKET SIP 25POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Wire Wrap Housing Material: Polyamide (PA), Nylon, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
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25-0503-30 | ARIES |
Description: ARIES - 25-0503-30 - IC- & Baustein-Sockel, 25 Kontakt(e), SIP-Buchse, 2.54 mm, 0503 Series, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 25Kontakt(e) Reihenabstand: - Steckverbinder: SIP-Buchse Produktpalette: 0503 Series productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 12 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 25-0503-30 |
|
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.94 EUR |
| 10+ | 23.79 EUR |
| 100+ | 18.58 EUR |
| 25-0503-30 |
|
Hersteller: ARIES
Description: ARIES - 25-0503-30 - IC- & Baustein-Sockel, 25 Kontakt(e), SIP-Buchse, 2.54 mm, 0503 Series, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 25Kontakt(e)
Reihenabstand: -
Steckverbinder: SIP-Buchse
Produktpalette: 0503 Series
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 25-0503-30 - IC- & Baustein-Sockel, 25 Kontakt(e), SIP-Buchse, 2.54 mm, 0503 Series, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 25Kontakt(e)
Reihenabstand: -
Steckverbinder: SIP-Buchse
Produktpalette: 0503 Series
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 12 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 46.16 EUR |
| 10+ | 34.09 EUR |