256-4205-01 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets Textool QFN .4MM,56P EVEN ROW,W/THRML PI
| Anzahl | Privatkunde |
|---|---|
| 1+ | 279.46 EUR |
| 10+ | 237.57 EUR |
| 25+ | 222.7 EUR |
| 50+ | 220.46 EUR |
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Technische Details 256-4205-01 3M Electronic Solutions Division
Description: CONN SOCKET QFN 56POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 56 (4 x 14), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.016" (0.40mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.016" (0.40mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 256-4205-01 nach Preis ab 234.08 EUR bis 293.74 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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256-4205-01 | 3M |
Description: CONN SOCKET QFN 56POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: QFN Number of Positions or Pins (Grid): 56 (4 x 14) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.016" (0.40mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.016" (0.40mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 256-4205-01 |
|
Hersteller: 3M
Description: CONN SOCKET QFN 56POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 56 (4 x 14)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.016" (0.40mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.016" (0.40mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET QFN 56POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 56 (4 x 14)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.016" (0.40mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.016" (0.40mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 293.74 EUR |
| 10+ | 249.7 EUR |
| 25+ | 234.08 EUR |