
264-1300-00-0602J 3M Electronic Solutions Division

IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty.
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 61.3 EUR |
10+ | 54.16 EUR |
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Technische Details 264-1300-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 64POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 264-1300-00-0602J nach Preis ab 54.05 EUR bis 74.8 EUR
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264-1300-00-0602J | Hersteller : 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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264-1300-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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264-1300-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |