264-4493-00-0602J
Produktcode: 194323
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Hersteller:
Steckverbinder, Reihenklemmen > Steckverbindungen sonstige
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Weitere Produktangebote 264-4493-00-0602J nach Preis ab 88.74 EUR bis 127.76 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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264-4493-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 64POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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264-4493-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.100" DIP SOCKET 64 Contact Qty. |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 264-4493-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 123.63 EUR |
| 10+ | 105.09 EUR |
| 264-4493-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 64 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 64 Contact Qty.
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 127.76 EUR |
| 10+ | 103.13 EUR |
| 20+ | 93.87 EUR |
| 50+ | 91.4 EUR |
| 100+ | 88.74 EUR |


