28-350002-11-RC Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.66 EUR |
| 50+ | 63.33 EUR |
| 100+ | 50.56 EUR |
| 250+ | 50.54 EUR |
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Technische Details 28-350002-11-RC Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3, Material: FR4 Epoxy Glass, Package Accepted: SOIC, Proto Board Type: DIP to DIP, Board Thickness: 0.062" (1.57mm), Pitch: 0.050" (1.27mm), Number of Positions: 28, Board Material: FR4 Epoxy Glass, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Pitch - Mating: 0.050" (1.27mm), Termination: Solder, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Convert From (Adapter End): SOIC, Mounting Type: Through Hole, Number of Pins: 28, Packaging: Tube.
Weitere Produktangebote 28-350002-11-RC
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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28-350002-11-RC | Aries Electronics |
 Description: SOCKET ADAPTER SOIC TO 28DIP 0.3Material: FR4 Epoxy Glass Package Accepted: SOIC Proto Board Type: DIP to DIP Board Thickness: 0.062" (1.57mm) Pitch: 0.050" (1.27mm) Number of Positions: 28 Board Material: FR4 Epoxy Glass Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SOIC Mounting Type: Through Hole Number of Pins: 28 Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 14 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 28-350002-11-RC |
|
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 28
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Tube
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 28
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 14 Stücke
Im Einkaufswagen
Stück im Wert von UAH