28-6556-11 Aries Electronics

Description: CONN IC DIP SOCKET 28POS GOLD, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.