Produkte > ARIES > 28-6574-10
28-6574-10

28-6574-10 ARIES

86901.pdf
Hersteller: ARIES
Description: ARIES - 28-6574-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, 6574, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: 6574
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 28-6574-10 ARIES

Description: CONN IC DIP SOCKET ZIF 28POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 28-6574-10

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-10 28-6574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket-336489.pdf IC & Component Sockets QUICK RELEASE 28 PIN TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-10 10019-universal-zif-test-and-burn-in-socket.pdf
28-6574-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6574-10 10019-universal-zif-test-and-burn-in-socket-336489.pdf
28-6574-10
Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 28 PIN TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH