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280-PRS19006-12 Aries Electronics

10004_pga_zif_test_and_burn_in_socket-2325324.pdf
Hersteller: Aries Electronics
IC & Component Sockets 280 PIN PGA GOLD
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+256.09 EUR
10+244.99 EUR
25+240.23 EUR
50+236.25 EUR
100+229.88 EUR
250+226.7 EUR
500+224.33 EUR
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Technische Details 280-PRS19006-12 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 125°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm).

Weitere Produktangebote 280-PRS19006-12

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
280-PRS19006-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
280-PRS19006-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH