| Anzahl | Preis |
|---|---|
| 1+ | 12.67 EUR |
| 10+ | 11.49 EUR |
| 25+ | 10.86 EUR |
| 50+ | 10.54 EUR |
| 100+ | 10.01 EUR |
| 250+ | 8.96 EUR |
| 500+ | 8.43 EUR |
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Technische Details 299-43-308-11-001000 Mill-Max
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy.
Weitere Produktangebote 299-43-308-11-001000 nach Preis ab 21.05 EUR bis 32.63 EUR
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299-43-308-11-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 8POS GOLDContact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy |
auf Bestellung 704 Stücke: Lieferzeit 10-14 Tag (e) |
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