auf Bestellung 133 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 7.27 EUR |
10+ | 5.12 EUR |
84+ | 4.96 EUR |
252+ | 4.4 EUR |
504+ | 4.22 EUR |
1008+ | 3.85 EUR |
2772+ | 3.75 EUR |
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Technische Details 299-83-310-11-001101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 299-83-310-11-001101
Foto | Bezeichnung | Hersteller | Beschreibung |
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299-83-310-11-001101 | Hersteller : Preci-Dip |
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Produkt ist nicht verfügbar |
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299-83-310-11-001101 | Hersteller : Preci-Dip |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |