auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 10.7 EUR |
10+ | 9.68 EUR |
30+ | 9.13 EUR |
60+ | 8.91 EUR |
120+ | 8.47 EUR |
270+ | 7.55 EUR |
510+ | 7.11 EUR |
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Technische Details 299-83-314-11-001101 Preci-dip
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 299-83-314-11-001101
Foto | Bezeichnung | Hersteller | Beschreibung |
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299-83-314-11-001101 | Hersteller : Preci-Dip |
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Produkt ist nicht verfügbar |
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299-83-314-11-001101 | Hersteller : Preci-Dip |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |