30-6823-90T Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS TIN
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 30 (2 x 15)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
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Technische Details 30-6823-90T Aries Electronics
Description: CONN IC DIP SOCKET 30POS TIN, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 30 (2 x 15), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin.
Weitere Produktangebote 30-6823-90T
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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30-6823-90T | Hersteller : Aries Electronics |
IC & Component Sockets VERTISOCKETS HORIZ BIFURCATED 30 PINS |
Produkt ist nicht verfügbar |