303MM Wakefield-Vette
Hersteller: Wakefield-VetteDescription: HEATSINK COMPACT
Packaging: Bulk
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 3.000" (76.20mm)
Package Cooled: Stud Mounted Semiconductor Cases
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 15.0W @ 37°C
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
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Technische Details 303MM Wakefield-Vette
Description: HEATSINK COMPACT, Packaging: Bulk, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 3.000" (76.20mm), Package Cooled: Stud Mounted Semiconductor Cases, Attachment Method: Press Fit, Power Dissipation @ Temperature Rise: 15.0W @ 37°C, Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM, Fin Height: 2.000" (50.80mm), Material Finish: Black Anodized.
Weitere Produktangebote 303MM
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 303MM | Hersteller : Wakefield-Vette |
Heat Sinks Heat Sink for Dual Stud-Mount, 50.8x50.8x76.2mm, (2) 10-32UNF, 0.625" Thread |
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