303N Wakefield Thermal
Hersteller: Wakefield Thermal
Heat Sinks Heat Sink for Dual Stud-Mount, 50.8x50.8x76.2mm, (1) 1 4 -28UNF, 0.625" Thread
| Anzahl | Privatkunde |
|---|---|
| 1+ | 63.25 EUR |
| 10+ | 59.02 EUR |
| 30+ | 56.6 EUR |
| 60+ | 56.3 EUR |
| 270+ | 56.19 EUR |
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Technische Details 303N Wakefield Thermal
Description: HEATSINK COMPACT, Packaging: Bulk, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 3.000" (76.20mm), Package Cooled: Stud Mounted Semiconductor Cases, Attachment Method: Press Fit, Power Dissipation @ Temperature Rise: 15.0W @ 37°C, Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM, Fin Height: 2.000" (50.80mm), Material Finish: Black Anodized.
Weitere Produktangebote 303N nach Preis ab 69.65 EUR bis 81.37 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 303N | Wakefield-Vette |
Description: HEATSINK COMPACT Packaging: Bulk Material: Aluminum Alloy Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 3.000" (76.20mm) Package Cooled: Stud Mounted Semiconductor Cases Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 15.0W @ 37°C Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM Fin Height: 2.000" (50.80mm) Material Finish: Black Anodized |
auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 303N |
|
Hersteller: Wakefield-Vette
Description: HEATSINK COMPACT
Packaging: Bulk
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 3.000" (76.20mm)
Package Cooled: Stud Mounted Semiconductor Cases
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 15.0W @ 37°C
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
Description: HEATSINK COMPACT
Packaging: Bulk
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 3.000" (76.20mm)
Package Cooled: Stud Mounted Semiconductor Cases
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 15.0W @ 37°C
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 250 LFM
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 81.37 EUR |
| 10+ | 72.19 EUR |
| 30+ | 69.65 EUR |