32-3573-16 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
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Technische Details 32-3573-16 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Beryllium Nickel, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Nickel Boron, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Nickel, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Nickel Boron, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing.
Weitere Produktangebote 32-3573-16
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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32-3573-16 | Hersteller : Aries Electronics |
IC & Component Sockets QUICK RELEASE 32 PIN NICKEL |
Produkt ist nicht verfügbar |