325705R00000G Boyd Corporation

Description: BOARD LEVEL HEAT SINK, Material Finish: Red Anodized, Fin Height: 0.250" (6.35mm), Thermal Resistance @ Natural: 60.00°C/W, Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 60°C, Attachment Method: Press Fit, Package Cooled: TO-5, Type: Board Level, Shape: Cylindrical, Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD, Material: Aluminum, Packaging: Bulk.