325705R00000G Boyd Corporation

Description: BOARD LEVEL HEAT SINK, Packaging: Bulk, Material: Aluminum, Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD, Shape: Cylindrical, Type: Board Level, Package Cooled: TO-5, Attachment Method: Press Fit, Power Dissipation @ Temperature Rise: 1.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 60.00°C/W, Fin Height: 0.250" (6.35mm), Material Finish: Red Anodized.