371924B00032G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: 371924B00032G
Material Finish: Black Anodized
Fin Height: 0.551" (14.00mm)
Thermal Resistance @ Natural: 31.90°C/W
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA, FPGA
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Bulk
Produktrezensionen
Produktbewertung abgeben
Technische Details 371924B00032G Boyd Laconia, LLC
Description: 371924B00032G, Material Finish: Black Anodized, Fin Height: 0.551" (14.00mm), Thermal Resistance @ Natural: 31.90°C/W, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 60°C, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: BGA, FPGA, Width: 1.378" (35.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.378" (35.00mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote 371924B00032G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
371924B00032G | Hersteller : Aavid |
 Heat Sinks Pin Fin Heat Sink for BGA, FPGA, 35x35x14mm, T405R Chomerics Tape Metal Surface |
Produkt ist nicht verfügbar |