Technische Details 373324M00000G BOYD CORP
Description: HEATSINK BGA W/OUT AD-TAPE, Packaging: Box, Material: Aluminum, Length: 1.472" (37.39mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.472" (37.39mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Fin Height: 0.236" (6.00mm), Material Finish: Green Anodized.
Weitere Produktangebote 373324M00000G
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373324M00000G | Hersteller : Boyd Laconia, LLC |
 Description: HEATSINK BGA W/OUT AD-TAPEPackaging: Box Material: Aluminum Length: 1.472" (37.39mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.472" (37.39mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Fin Height: 0.236" (6.00mm) Material Finish: Green Anodized |
Produkt ist nicht verfügbar |
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| 373324M00000G | Hersteller : Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA, Horizontal/Vertical, T405R Chomerics Tape |
Produkt ist nicht verfügbar |