373324M00000G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE
Material Finish: Green Anodized
Fin Height: 0.236" (6.00mm)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.472" (37.39mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.472" (37.39mm)
Material: Aluminum
Packaging: Box
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Technische Details 373324M00000G Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE, Material Finish: Green Anodized, Fin Height: 0.236" (6.00mm), Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.472" (37.39mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.472" (37.39mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote 373324M00000G
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 373324M00000G | Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA, Horizontal/Vertical, T405R Chomerics Tape |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5460 Stücke Im Einkaufswagen Stück im Wert von UAH |