374124B60023G Aavid Thermalloy
Hersteller: Aavid ThermalloyHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4C/W Black Anodized
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Technische Details 374124B60023G Aavid Thermalloy
Description: 374124B60023G, Packaging: Bulk, Material: Aluminum, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.40°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374124B60023G
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374124B60023G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized |
Produkt ist nicht verfügbar |
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| 374124B60023G | Hersteller : Boyd Laconia, LLC |
Description: 374124B60023G Packaging: Bulk Material: Aluminum Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized |
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374124B60023G | Hersteller : Aavid |
Heat Sinks Heat Sink with BGA Solder Anchor, 23x23x18mm, Black, 2 Anchors, IC Pkg=23 x 23 |
Produkt ist nicht verfügbar |
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| 374124B60023G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm Height: 18mm Width: 23mm Length: 23mm Material: aluminium Material finishing: anodized Application: BGA; FPGA Colour: black Type of heatsink: extruded Heatsink shape: grilled |
Produkt ist nicht verfügbar |