374824B00032G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA Pin Array Adhesive Aluminum 12°C/W Black Anodized
auf Bestellung 336 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 336+ | 4.97 EUR |
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Technische Details 374824B00032G Boyd Corporation
Description: 374824B00032G, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.00°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374824B00032G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 374824B00032G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA Pin Array Adhesive Aluminum 12C/W Black Anodized |
auf Bestellung 328 Stücke: Lieferzeit 14-21 Tag (e) |
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| 374824B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm Length: 35mm Material: aluminium Colour: black Heatsink shape: grilled Material finishing: anodized Application: BGA; FPGA Height: 25mm Width: 35mm Type of heatsink: extruded Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| 374824B00032G | Hersteller : Boyd Laconia, LLC |
Description: 374824B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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374824B00032G | Hersteller : Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 35x35x25mm, IC=35x35, Tape #32 |
Produkt ist nicht verfügbar |
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| 374824B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm Length: 35mm Material: aluminium Colour: black Heatsink shape: grilled Material finishing: anodized Application: BGA; FPGA Height: 25mm Width: 35mm Type of heatsink: extruded |
Produkt ist nicht verfügbar |