Produkte > TE CONNECTIVITY > 4-1571551-6
4-1571551-6

4-1571551-6 TE Connectivity

ENG_CD_1571551_C6-2011885.pdf
Hersteller: TE Connectivity
IC & Component Sockets SOLID FRAME PC 20P
auf Bestellung 622 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 4-1571551-6 TE Connectivity

Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Nickel.

Weitere Produktangebote 4-1571551-6

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
4-1571551-6 4-1571551-6 TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Nickel
Produkt ist nicht verfügbar
 Mindestbestellmenge: 960 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
4-1571551-6 DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English
4-1571551-6
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Nickel
Produkt ist nicht verfügbar
Mindestbestellmenge: 960 Stücke
Im Einkaufswagen  Stück im Wert von  UAH