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4-1571551-9 TE Connectivity

DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English
Hersteller: TE Connectivity
Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube
auf Bestellung 405 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
22+8.1 EUR
23+7.68 EUR
25+7.24 EUR
50+6.56 EUR
100+5.96 EUR
250+5.37 EUR
Mindestbestellmenge: 22 Stücke
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Technische Details 4-1571551-9 TE Connectivity

Description: CONN IC DIP SOCKET 28POS GOLD, Contact Material - Post: Nickel, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.

Weitere Produktangebote 4-1571551-9

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
4-1571551-9 4-1571551-9 TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Nickel
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Produkt ist nicht verfügbar
 Mindestbestellmenge: 425 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
4-1571551-9 DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English
4-1571551-9
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Nickel
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 425 Stücke
Im Einkaufswagen  Stück im Wert von  UAH