4-1571552-5 TE Connectivity
auf Bestellung 858 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
65+ | 2.42 EUR |
250+ | 2.29 EUR |
450+ | 2.18 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 4-1571552-5 TE Connectivity
Description: CONN IC DIP SOCKET 18POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper.
Weitere Produktangebote 4-1571552-5 nach Preis ab 1.94 EUR bis 2.2 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||
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4-1571552-5 | Hersteller : TE Connectivity |
Category: Unclassified Description: 4-1571552-5 |
auf Bestellung 858 Stücke: Lieferzeit 14-21 Tag (e) |
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4-1571552-5 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 4-1571552-5 - IC COMPONENT SOCKETS CONNECTORS tariffCode: 85366990 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 |
auf Bestellung 700 Stücke: Lieferzeit 14-21 Tag (e) |
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4-1571552-5 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Copper |
Produkt ist nicht verfügbar |