Produkte > TE CONNECTIVITY > 4-1571552-5

4-1571552-5 TE Connectivity

Name: 4-1571552-5
Brand: TE Connectivity
SKU: 10702877-5
Price: 148.85 EUR
Availability: InStock

Hersteller: TE Connectivity
Conn DIP Socket RCP 18 POS 2.54mm Solder ST Thru-Hole Tube

auf Bestellung 357 Stücke:

Lieferzeit 14-21 Tag (e)

Anzahl	Privatkunde
65+	2.73 EUR
250+	2.64 EUR

Mindestbestellmenge: 65 Stücke

Im Einkaufswagen Stück im Wert von UAH

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Technische Details 4-1571552-5 TE Connectivity

Description: CONN IC DIP SOCKET 18POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper.

Weitere Produktangebote 4-1571552-5

Foto	Bezeichnung	Hersteller	Beschreibung	Verfügbarkeit	Privatkunde
	4-1571552-5	TE Connectivity AMP Connectors	Description: CONN IC DIP SOCKET 18POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Copper	Produkt ist nicht verfügbar Benachrichtigung bei Verfügbarkeit	Mindestbestellmenge: 4160 Stücke Im Einkaufswagen Stück im Wert von UAH

4-1571552-5

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Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Copper

Produkt ist nicht verfügbar

Mindestbestellmenge: 4160 Stücke

Im Einkaufswagen Stück im Wert von UAH