4-1571552-6 TE Connectivity
auf Bestellung 1494 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 45+ | 3.25 EUR |
| 150+ | 3.08 EUR |
| 300+ | 2.91 EUR |
| 600+ | 2.75 EUR |
| 960+ | 2.59 EUR |
Produktrezensionen
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Technische Details 4-1571552-6 TE Connectivity
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper.
Weitere Produktangebote 4-1571552-6 nach Preis ab 2.86 EUR bis 3.43 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 4-1571552-6 | Hersteller : TE Connectivity |
 Category: Precision socketsDescription: Socket: integrated circuits; Pitch: 2.54mm; THT; gold flash; 3A Type of Socket: integrated circuits Terminal pitch: 2.54mm Electrical mounting: THT Contact plating: gold flash Row pitch: 7.62mm Max. contact resistance:: 10mΩ Flammability rating: UL94V-0 Maximum current: 3A Operating temperature: -55...105°C |
auf Bestellung 1494 Stücke: Lieferzeit 14-21 Tag (e) |
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| 4-1571552-6 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 4-1571552-6 - IC-COMPONENT SOCKETS DIP .3CL 20P tariffCode: 85366990 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 SVHC: To Be Advised |
auf Bestellung 1196 Stücke: Lieferzeit 14-21 Tag (e) |
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4-1571552-6 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Copper |
Produkt ist nicht verfügbar |
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4-1571552-6 | Hersteller : TE Connectivity |
IC & Component Sockets DIP .3CL 20P S&R OFRM AU/SN |
Produkt ist nicht verfügbar |