40-0518-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
| Anzahl | Preis |
|---|---|
| 3+ | 7.66 EUR |
| 10+ | 6.51 EUR |
| 100+ | 5.53 EUR |
| 500+ | 4.94 EUR |
| 1000+ | 4.7 EUR |
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Technische Details 40-0518-10 Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 40 (1 x 40), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 40-0518-10 nach Preis ab 5.74 EUR bis 8.41 EUR
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40-0518-10 | Hersteller : ARIES |
Description: ARIES - 40-0518-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 40Kontakt(e) Steckverbinder: DIP euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 |
auf Bestellung 265 Stücke: Lieferzeit 14-21 Tag (e) |
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