| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.41 EUR |
| 11+ | 22.26 EUR |
| 22+ | 20.61 EUR |
| 55+ | 19.87 EUR |
| 110+ | 18.85 EUR |
| 253+ | 17.85 EUR |
| 506+ | 17.01 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-526-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 40-526-10 nach Preis ab 18.96 EUR bis 26.43 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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40-526-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 175 Stücke: Lieferzeit 10-14 Tag (e) |
|
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|
40-526-10 | ARIES |
Description: ARIES - 40-526-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, BerylliumkupfertariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 40Kontakt(e) Reihenabstand: 15.24mm Steckverbinder: DIP Produktpalette: 526 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 43 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| 40-526-10 | ARIES |
DIP 10+ |
auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 40-526-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 175 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.43 EUR |
| 11+ | 22.3 EUR |
| 33+ | 20.63 EUR |
| 55+ | 19.91 EUR |
| 110+ | 18.96 EUR |
| 40-526-10 |
![]() |
Hersteller: ARIES
Description: ARIES - 40-526-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: 526
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 40-526-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: 526
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 43 Stücke:
Lieferzeit 14-21 Tag (e)
| 40-526-10 |
![]() |
Hersteller: ARIES
DIP 10+
DIP 10+
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)




