40-6572-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
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Technische Details 40-6572-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN, Packaging: Bulk, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame.
Weitere Produktangebote 40-6572-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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40-6572-10 | Hersteller : Aries Electronics |
IC & Component Sockets QUICK RELEASE 40 PIN TIN |
Produkt ist nicht verfügbar |