40-C212-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
| Anzahl | Preis |
|---|---|
| 2+ | 14.56 EUR |
| 10+ | 12.36 EUR |
| 25+ | 11.59 EUR |
| 50+ | 11.03 EUR |
| 100+ | 10.51 EUR |
| 250+ | 10.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-C212-10 Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin.
Weitere Produktangebote 40-C212-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
40-C212-10 | Hersteller : Aries Electronics |
IC & Component Sockets LOCK/EJECT DIP SCKT SOLDER TAIL 40 PINS |
auf Bestellung 134 Stücke: Lieferzeit 10-14 Tag (e) |
