44764-1403 Molex
auf Bestellung 2850 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 30+ | 10.77 EUR |
| 300+ | 9.25 EUR |
| 600+ | 8.27 EUR |
| 1200+ | 7.4 EUR |
Produktrezensionen
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Technische Details 44764-1403 Molex
Description: MICRO-FIT BMI RECEPTACLE HEADER,, Features: Blind Mating, Board Guide, Packaging: Box, Connector Type: Receptacle, Voltage Rating: 600VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Right Angle, Number of Positions: 14, Style: Board to Board or Cable, Operating Temperature: -40°C ~ 105°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.155" (3.94mm), Insulation Height: 0.410" (10.41mm), Row Spacing - Mating: 0.118" (3.00mm), Number of Rows: 2.
Weitere Produktangebote 44764-1403 nach Preis ab 11.2 EUR bis 12.36 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||
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44764-1403 | Hersteller : Molex |
Conn Wire to Board RCP 14Power POS 3mm Solder RA Side Entry Thru-Hole Tray |
auf Bestellung 208 Stücke: Lieferzeit 14-21 Tag (e) |
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44764-1403 | Hersteller : Molex |
Headers & Wire Housings MicroFit (3.0) BMI R A Hdr/Fem 30Au 14Ckt |
auf Bestellung 651 Stücke: Lieferzeit 10-14 Tag (e) |
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44764-1403 | Hersteller : Molex |
Description: MICRO-FIT BMI RECEPTACLE HEADER,Features: Blind Mating, Board Guide Packaging: Box Connector Type: Receptacle Voltage Rating: 600VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole, Right Angle Number of Positions: 14 Style: Board to Board or Cable Operating Temperature: -40°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.155" (3.94mm) Insulation Height: 0.410" (10.41mm) Row Spacing - Mating: 0.118" (3.00mm) Number of Rows: 2 |
auf Bestellung 210 Stücke: Lieferzeit 10-14 Tag (e) |
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44764-1403 | Hersteller : MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 44764-1403 - Printbuchse, Board-to-Board, Power, Wire-to-Board, 3 mm, 2 Reihe(n), 14 Kontakt(e)tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 3mm Anzahl der Kontakte: 14Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board, Power, Wire-to-Board Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Durchsteckmontage, abgewinkelt Produktpalette: Micro-Fit BMI 44764 Series SVHC: No SVHC (27-Jun-2024) |
auf Bestellung 29 Stücke: Lieferzeit 14-21 Tag (e) |



