| Anzahl | Preis |
|---|---|
| 4+ | 0.71 EUR |
| 10+ | 0.51 EUR |
| 25+ | 0.38 EUR |
| 100+ | 0.21 EUR |
| 250+ | 0.17 EUR |
| 500+ | 0.14 EUR |
| 1000+ | 0.11 EUR |
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Technische Details 4605X-101-393LF Bourns
Description: RNET - THK FILM CONF SIP, Height - Seated (Max): 0.200" (5.08mm), Supplier Device Package: 5-SIP, Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Size / Dimension: 0.498" L x 0.098" W (12.65mm x 2.49mm), Temperature Coefficient: ±100ppm/°C, Package / Case: 5-SIP, Number of Pins: 5, Circuit Type: Bussed, Power Per Element: 200mW, Tolerance: ±2%, Resistance (Ohms): 39k, Packaging: Bag, Number of Resistors: 4, Resistor-Ratio-Drift: 50ppm/°C.
Weitere Produktangebote 4605X-101-393LF
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 4605X-101-393LF | Hersteller : Bourns Inc. |
 Description: RNET - THK FILM CONF SIPHeight - Seated (Max): 0.200" (5.08mm) Supplier Device Package: 5-SIP Operating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Size / Dimension: 0.498" L x 0.098" W (12.65mm x 2.49mm) Temperature Coefficient: ±100ppm/°C Package / Case: 5-SIP Number of Pins: 5 Circuit Type: Bussed Power Per Element: 200mW Tolerance: ±2% Resistance (Ohms): 39k Packaging: Bag Number of Resistors: 4 Resistor-Ratio-Drift: 50ppm/°C |
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