4608X-AP2-223LF Bourns Inc.
Hersteller: Bourns Inc.
Description: RES ARRAY 4 RES 22K OHM 8SIP
Operating Temperature: -55°C ~ 125°C
Mounting Type: Through Hole
Size / Dimension: 0.798" L x 0.098" W (20.27mm x 2.49mm)
Temperature Coefficient: ±100ppm/°C
Package / Case: 8-SIP
Number of Pins: 8
Circuit Type: Isolated
Power Per Element: 300mW
Tolerance: ±2%
Resistance (Ohms): 22k
Packaging: Tape & Box (TB)
Number of Resistors: 4
Part Status: Active
Height - Seated (Max): 0.200" (5.08mm)
Supplier Device Package: 8-SIP
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Technische Details 4608X-AP2-223LF Bourns Inc.
Description: RES ARRAY 4 RES 22K OHM 8SIP, Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Size / Dimension: 0.798" L x 0.098" W (20.27mm x 2.49mm), Temperature Coefficient: ±100ppm/°C, Package / Case: 8-SIP, Number of Pins: 8, Circuit Type: Isolated, Power Per Element: 300mW, Tolerance: ±2%, Resistance (Ohms): 22k, Packaging: Tape & Box (TB), Number of Resistors: 4, Part Status: Active, Height - Seated (Max): 0.200" (5.08mm), Supplier Device Package: 8-SIP.
Weitere Produktangebote 4608X-AP2-223LF
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
4608X-AP2-223LF | Bourns |
Resistor Networks & Arrays THICK FILM 2% 22K CONFRML SIP |
auf Bestellung 3999 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 4608X-AP2-223LF |
|
Hersteller: Bourns
Resistor Networks & Arrays THICK FILM 2% 22K CONFRML SIP
Resistor Networks & Arrays THICK FILM 2% 22K CONFRML SIP
auf Bestellung 3999 Stücke:
Lieferzeit 10-14 Tag (e)