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Technische Details 4612X-101-393LF Bourns
Description: RNET - THK FILM CONF SIP, Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Size / Dimension: 1.198" L x 0.098" W (30.43mm x 2.49mm), Temperature Coefficient: ±100ppm/°C, Package / Case: 12-SIP, Number of Pins: 12, Circuit Type: Bussed, Power Per Element: 200mW, Tolerance: ±2%, Resistance (Ohms): 39k, Packaging: Bulk, Number of Resistors: 11, Resistor-Ratio-Drift: 50ppm/°C, Height - Seated (Max): 0.200" (5.08mm), Supplier Device Package: 12-SIP.
Weitere Produktangebote 4612X-101-393LF
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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4612X-101-393LF | Hersteller : Bourns Inc. |
Description: RNET - THK FILM CONF SIPOperating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Size / Dimension: 1.198" L x 0.098" W (30.43mm x 2.49mm) Temperature Coefficient: ±100ppm/°C Package / Case: 12-SIP Number of Pins: 12 Circuit Type: Bussed Power Per Element: 200mW Tolerance: ±2% Resistance (Ohms): 39k Packaging: Bulk Number of Resistors: 11 Resistor-Ratio-Drift: 50ppm/°C Height - Seated (Max): 0.200" (5.08mm) Supplier Device Package: 12-SIP |
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