48-6570-11 Aries Electronics
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 68.85 EUR |
12+ | 60.3 EUR |
30+ | 57.69 EUR |
54+ | 55.83 EUR |
102+ | 53.96 EUR |
252+ | 50.99 EUR |
504+ | 49.49 EUR |
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Technische Details 48-6570-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 48-6570-11
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
48-6570-11 | Hersteller : Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 48POS GLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
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