4818-3004-CP 3M Electronic Solutions Division

Description: CONN IC DIP SOCKET 18POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -25°C ~ 85°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 35.4µin (0.90µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 35.0µin (0.90µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.