Technische Details 4860P-250G MG Chemicals
Description: LEADED NO CLEAN SOLDER PASTE, Shelf Life: 24 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C), Flux Type: No-Clean, Process: Leaded, Mesh Type: 3, Form: Jar, 8.8 oz (250g), Melting Point: 361°F (183°C), Type: Solder Paste, Composition: Sn63Pb37 (63/37), Packaging: Bulk.
Weitere Produktangebote 4860P-250G
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
4860P-250G | MG Chemicals |
 Description: LEADED NO CLEAN SOLDER PASTEShelf Life: 24 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C) Flux Type: No-Clean Process: Leaded Mesh Type: 3 Form: Jar, 8.8 oz (250g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 4860P-250G |
|
Hersteller: MG Chemicals
Description: LEADED NO CLEAN SOLDER PASTE
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C)
Flux Type: No-Clean
Process: Leaded
Mesh Type: 3
Form: Jar, 8.8 oz (250g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: LEADED NO CLEAN SOLDER PASTE
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C)
Flux Type: No-Clean
Process: Leaded
Mesh Type: 3
Form: Jar, 8.8 oz (250g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH