5-104894-3 TE Connectivity

Description: CONN HEADER SMD R/A 30POS 1.27MM, Features: Board Lock, Solder Retention, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 0.5A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Number of Rows: 2, Style: Board to Board, Operating Temperature: -65°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Circular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm).