Technische Details 500913-0302 Molex
Description: MOLEX - 500913-0302 - Mezzanine-Steckverbinder, Buchse, 0.4 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage, tariffCode: 85366930, euEccn: NLR, rohsCompliant: YES, Kontaktüberzug: Vergoldete Kontakte, hazardous: false, rohsPhthalatesCompliant: YES, Kontaktmaterial: Phosphorbronze, isCanonical: Y, Ausführung: Buchse, Steckverbindermontage: Oberflächenmontage, Anzahl der Kontakte: 30Kontakt(e), SVHC: No SVHC (04-Feb-2026), Produktpalette: SlimStack 500913, productTraceability: No, Kontaktanschluss: Oberflächenmontage, usEccn: EAR99, Anzahl der Reihen: 2Reihe(n), Mezzanine-Steckverbinder: Buchse, Rastermaß: 0.4mm.
Weitere Produktangebote 500913-0302 nach Preis ab 1.14 EUR bis 2.43 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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5009130302 | Molex |
 Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R |
auf Bestellung 1500 Stücke: Lieferzeit 14-21 Tag (e) |
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5009130302 | Molex |
Description: CONN RCPT 30POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 1.8mm Contact Finish Thickness: 8.00µin (0.203µm) Height Above Board: 0.063" (1.60mm) Pitch: 0.016" (0.40mm) Number of Positions: 30 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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5009130302 | Molex |
Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R |
auf Bestellung 9000 Stücke: Lieferzeit 14-21 Tag (e) |
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5009130302 | Molex |
Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.063" (1.60mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 1.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 13935 Stücke: Lieferzeit 10-14 Tag (e) |
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500913-0302 | MOLEX |
Description: MOLEX - 500913-0302 - Mezzanine-Steckverbinder, Buchse, 0.4 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Ausführung: Buchse Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 30Kontakt(e) SVHC: No SVHC (04-Feb-2026) Produktpalette: SlimStack 500913 productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Mezzanine-Steckverbinder: Buchse Rastermaß: 0.4mm |
auf Bestellung 331 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 500913-0302 | MOLEX |
Category: Board-to-board connectors Description: Connector: PCB to PCB; socket; female; PIN: 30; vertical; 300mA; 50V Type of connector: PCB to PCB Electrical mounting: SMT Connector: socket Spatial orientation: vertical Operating temperature: -40...105°C Contacts pitch: 0.4mm Current rating: 0.3A Number of pins: 30 Rated voltage: 50V Kind of connector: female Contact plating: gold-plated Mechanical mounting: on PCBs |
auf Bestellung 9000 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 5009130302 |
|
Hersteller: Molex
Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R
Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R
auf Bestellung 1500 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 1.68 EUR |
| 5009130302 |
|
Hersteller: Molex
Description: CONN RCPT 30POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 1.8mm
Contact Finish Thickness: 8.00µin (0.203µm)
Height Above Board: 0.063" (1.60mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Description: CONN RCPT 30POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 1.8mm
Contact Finish Thickness: 8.00µin (0.203µm)
Height Above Board: 0.063" (1.60mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 1.72 EUR |
| 5009130302 |
|
Hersteller: Molex
Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R
Conn Board to Board RCP 30 POS 0.4mm Solder ST Top Entry SMD SlimStack T/R
auf Bestellung 9000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 500+ | 1.81 EUR |
| 1500+ | 1.75 EUR |
| 5009130302 |
|
Hersteller: Molex
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.063" (1.60mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 1.8mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.063" (1.60mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 1.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 13935 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.43 EUR |
| 10+ | 2.06 EUR |
| 100+ | 1.7 EUR |
| 500913-0302 |
|
Hersteller: MOLEX
Description: MOLEX - 500913-0302 - Mezzanine-Steckverbinder, Buchse, 0.4 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 30Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: SlimStack 500913
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Mezzanine-Steckverbinder: Buchse
Rastermaß: 0.4mm
Description: MOLEX - 500913-0302 - Mezzanine-Steckverbinder, Buchse, 0.4 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 30Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: SlimStack 500913
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Mezzanine-Steckverbinder: Buchse
Rastermaß: 0.4mm
auf Bestellung 331 Stücke:
Lieferzeit 14-21 Tag (e)
| 500913-0302 |
Hersteller: MOLEX
Category: Board-to-board connectors
Description: Connector: PCB to PCB; socket; female; PIN: 30; vertical; 300mA; 50V
Type of connector: PCB to PCB
Electrical mounting: SMT
Connector: socket
Spatial orientation: vertical
Operating temperature: -40...105°C
Contacts pitch: 0.4mm
Current rating: 0.3A
Number of pins: 30
Rated voltage: 50V
Kind of connector: female
Contact plating: gold-plated
Mechanical mounting: on PCBs
Category: Board-to-board connectors
Description: Connector: PCB to PCB; socket; female; PIN: 30; vertical; 300mA; 50V
Type of connector: PCB to PCB
Electrical mounting: SMT
Connector: socket
Spatial orientation: vertical
Operating temperature: -40...105°C
Contacts pitch: 0.4mm
Current rating: 0.3A
Number of pins: 30
Rated voltage: 50V
Kind of connector: female
Contact plating: gold-plated
Mechanical mounting: on PCBs
auf Bestellung 9000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 1.14 EUR |