5019312070 Molex
auf Bestellung 550 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 550+ | 1.76 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 5019312070 Molex
Description: CONN RCPT 20POS 0.049 GOLD SMD, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.346" (8.80mm), Number of Rows: 2.
Weitere Produktangebote 5019312070 nach Preis ab 2.05 EUR bis 4.33 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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5019312070 | Hersteller : Molex |
 Conn Wire to Board RCP 20 POS 1.25mm Solder ST Top Entry SMD Duo-Clasp T/R |
auf Bestellung 1650 Stücke: Lieferzeit 14-21 Tag (e) |
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5019312070 | Hersteller : Molex |
Description: CONN RCPT 20POS 0.049 GOLD SMD Packaging: Cut Tape (CT) Features: Pick and Place, Solder Retention Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.346" (8.80mm) Number of Rows: 2 |
auf Bestellung 522 Stücke: Lieferzeit 10-14 Tag (e) |
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501931-2070 | Hersteller : MOLEX |
Description: MOLEX - 501931-2070 - Printbuchse, Wire-to-Board, 1.25 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: 0 Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: Duo-Clasp 501931 productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 2190 Stücke: Lieferzeit 14-21 Tag (e) |
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5019312070 | Hersteller : Molex |
Conn Wire to Board RCP 20 POS 1.25mm Solder ST Top Entry SMD Duo-Clasp T/R |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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5019312070 | Hersteller : Molex |
Conn Wire to Board RCP 20 POS 1.25mm Solder ST Top Entry SMD Duo-Clasp T/R |
auf Bestellung 1650 Stücke: Lieferzeit 14-21 Tag (e) |
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5019312070 | Hersteller : Molex |
Conn Wire to Board RCP 20 POS 1.25mm Solder ST Top Entry SMD Duo-Clasp™ T/R |
Produkt ist nicht verfügbar |
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| 501931-2070 | Hersteller : MOLEX | 5019312070-MOL Signal connectors - Unclassified |
Produkt ist nicht verfügbar |
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5019312070 | Hersteller : Molex |
Description: CONN RCPT 20POS 0.049 GOLD SMD Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.346" (8.80mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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501931-2070 | Hersteller : Molex | Headers & Wire Housings 1.25 W/B S/T Rec 20C kt EmbsTp Pkg |
Produkt ist nicht verfügbar |