5019313070 Molex
Hersteller: Molex
Description: CONN RCPT 30POS 0.049 GOLD SMD
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.346" (8.80mm)
Number of Rows: 2
| Anzahl | Privatkunde |
|---|---|
| 550+ | 3.9 EUR |
| 1100+ | 3.71 EUR |
| 1650+ | 3.61 EUR |
| 2750+ | 3.47 EUR |
| 3850+ | 3.4 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
550 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 5019313070 Molex
Description: CONN RCPT 30POS 0.049 GOLD SMD, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.346" (8.80mm), Number of Rows: 2.
Weitere Produktangebote 5019313070 nach Preis ab 4.12 EUR bis 7.25 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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5019313070 | Molex |
Description: CONN RCPT 30POS 0.049 GOLD SMD Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.346" (8.80mm) Number of Rows: 2 |
auf Bestellung 4024 Stücke: Lieferzeit 10-14 Tag (e) |
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501931-3070 | Molex | Headers & Wire Housings 1.25 W/B S/T Rec 30C kt EmbsTp Pkg |
auf Bestellung 1111 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 5019313070 |
|
Hersteller: Molex
Description: CONN RCPT 30POS 0.049 GOLD SMD
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.346" (8.80mm)
Number of Rows: 2
Description: CONN RCPT 30POS 0.049 GOLD SMD
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.346" (8.80mm)
Number of Rows: 2
auf Bestellung 4024 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.09 EUR |
| 10+ | 5.18 EUR |
| 25+ | 4.84 EUR |
| 50+ | 4.62 EUR |
| 100+ | 4.39 EUR |
| 250+ | 4.12 EUR |
| 501931-3070 |
Hersteller: Molex
Headers & Wire Housings 1.25 W/B S/T Rec 30C kt EmbsTp Pkg
Headers & Wire Housings 1.25 W/B S/T Rec 30C kt EmbsTp Pkg
auf Bestellung 1111 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.25 EUR |
| 10+ | 6.58 EUR |
| 25+ | 6.24 EUR |
| 50+ | 6.09 EUR |
| 100+ | 5.81 EUR |
| 250+ | 5.07 EUR |
| 550+ | 4.94 EUR |