5019530307 Molex
Hersteller: Molex
Description: CONN HEADER SMD R/A 3POS 1MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.185" (4.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
| Anzahl | Privatkunde |
|---|---|
| 1300+ | 0.86 EUR |
| 2600+ | 0.81 EUR |
| 3900+ | 0.79 EUR |
| 6500+ | 0.76 EUR |
| 9100+ | 0.75 EUR |
| 13000+ | 0.73 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 5019530307 Molex
Description: CONN HEADER SMD R/A 3POS 1MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.185" (4.70mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.
Weitere Produktangebote 5019530307 nach Preis ab 0.7 EUR bis 1.46 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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501953-0307 | Molex | Headers & Wire Housings 1.0WtBWaferAssyR/A1- -Row3Ckt+LKEmbsTpPkg |
auf Bestellung 6092 Stücke: Lieferzeit 10-14 Tag (e) |
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5019530307 | Molex |
Description: CONN HEADER SMD R/A 3POS 1MMFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.185" (4.70mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
auf Bestellung 19934 Stücke: Lieferzeit 10-14 Tag (e) |
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501953-0307 | MOLEX |
Description: MOLEX - 501953-0307 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 1 Reihe(n), 3 Kontakt(e)tariffCode: 85366990 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 3Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Signal, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Pico-Clasp 501953 productTraceability: No Kontaktanschluss: Oberflächenmontage, abgewinkelt usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 1mm |
auf Bestellung 7249 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 501953-0307 |
Hersteller: Molex
Headers & Wire Housings 1.0WtBWaferAssyR/A1- -Row3Ckt+LKEmbsTpPkg
Headers & Wire Housings 1.0WtBWaferAssyR/A1- -Row3Ckt+LKEmbsTpPkg
auf Bestellung 6092 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.4 EUR |
| 10+ | 1.19 EUR |
| 100+ | 1.06 EUR |
| 500+ | 0.95 EUR |
| 1300+ | 0.73 EUR |
| 2600+ | 0.7 EUR |
| 5019530307 |
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Hersteller: Molex
Description: CONN HEADER SMD R/A 3POS 1MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.185" (4.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Description: CONN HEADER SMD R/A 3POS 1MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.185" (4.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
auf Bestellung 19934 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.46 EUR |
| 17+ | 1.24 EUR |
| 100+ | 1.05 EUR |
| 500+ | 0.94 EUR |
| 501953-0307 |
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Hersteller: MOLEX
Description: MOLEX - 501953-0307 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 1 Reihe(n), 3 Kontakt(e)
tariffCode: 85366990
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Pico-Clasp 501953
productTraceability: No
Kontaktanschluss: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1mm
Description: MOLEX - 501953-0307 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 1 Reihe(n), 3 Kontakt(e)
tariffCode: 85366990
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Pico-Clasp 501953
productTraceability: No
Kontaktanschluss: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1mm
auf Bestellung 7249 Stücke:
Lieferzeit 14-21 Tag (e)


