5023820872 Molex
Hersteller: Molex
Description: CONN RCPT 8POS 0.049 TIN SMD
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 2.3 EUR |
| 2800+ | 2.19 EUR |
| 4200+ | 2.12 EUR |
| 7000+ | 2.05 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
1400 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 5023820872 Molex
Description: CONN RCPT 8POS 0.049 TIN SMD, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 8, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.173" (4.40mm), Number of Rows: 1.
Weitere Produktangebote 5023820872 nach Preis ab 1.46 EUR bis 4.52 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
5023820872 | Molex |
Description: CONN RCPT 8POS 0.049 TIN SMD Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.173" (4.40mm) Number of Rows: 1 |
auf Bestellung 7743 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| 5023820872 | Molex |
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R |
auf Bestellung 176400 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||
| 5023820872 | Molex |
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R |
auf Bestellung 4200 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||
| 5023820872 | Molex |
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R |
auf Bestellung 8400 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||
| 5023820872 | Molex |
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R |
auf Bestellung 250600 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||
| 502382-0872 | Molex |
Description: 1.25W/BSGLSTRECASSY8CKTEMBSTPPKG Features: Pick and Place, Solder Retention Packaging: Bulk Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.173" (4.40mm) Number of Rows: 1 |
auf Bestellung 5600 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
| 5023820872 | Molex |
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R |
auf Bestellung 176400 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||
| 502382-0872 | MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 502382-0872 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Steckverbindermontage: Oberflächenmontage, gerade Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (25-Jun-2025) Steckverbindersysteme: Wire-to-Board Produktpalette: CLIK-Mate 502382 Series productTraceability: No usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm |
auf Bestellung 239400 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 5023820872 |
|
Hersteller: Molex
Description: CONN RCPT 8POS 0.049 TIN SMD
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
Description: CONN RCPT 8POS 0.049 TIN SMD
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
auf Bestellung 7743 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.33 EUR |
| 10+ | 2.82 EUR |
| 100+ | 2.4 EUR |
| 500+ | 2.14 EUR |
| 5023820872 |
|
Hersteller: Molex
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
auf Bestellung 176400 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8400+ | 1.82 EUR |
| 5023820872 |
|
Hersteller: Molex
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
auf Bestellung 4200 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.83 EUR |
| 5023820872 |
|
Hersteller: Molex
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
auf Bestellung 8400 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.83 EUR |
| 8400+ | 1.65 EUR |
| 5023820872 |
|
Hersteller: Molex
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
auf Bestellung 250600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.87 EUR |
| 4200+ | 1.8 EUR |
| 8400+ | 1.71 EUR |
| 21000+ | 1.57 EUR |
| 50400+ | 1.54 EUR |
| 100800+ | 1.51 EUR |
| 250600+ | 1.46 EUR |
| 502382-0872 |
Hersteller: Molex
Description: 1.25W/BSGLSTRECASSY8CKTEMBSTPPKG
Features: Pick and Place, Solder Retention
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
Description: 1.25W/BSGLSTRECASSY8CKTEMBSTPPKG
Features: Pick and Place, Solder Retention
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
auf Bestellung 5600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.99 EUR |
| 2800+ | 1.96 EUR |
| 5023820872 |
|
Hersteller: Molex
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 8 POS 1.25mm Solder ST SMD T/R
auf Bestellung 176400 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8400+ | 3.26 EUR |
| 502382-0872 |
|
Hersteller: MOLEX / PARTNER STOCK
Description: MOLEX / PARTNER STOCK - 502382-0872 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (25-Jun-2025)
Steckverbindersysteme: Wire-to-Board
Produktpalette: CLIK-Mate 502382 Series
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
Description: MOLEX / PARTNER STOCK - 502382-0872 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (25-Jun-2025)
Steckverbindersysteme: Wire-to-Board
Produktpalette: CLIK-Mate 502382 Series
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
auf Bestellung 239400 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 4.52 EUR |
| 4200+ | 3.93 EUR |